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50+ Engineers Driving Innovation: Angthumb’s R&D Powerhouse

Angthumb’s R&D department is the driving force behind its competitive advantage. With more than 50 experienced engineers, the team covers hardware design, BIOS development, signal integrity, circuit simulation, industrial PC design, and thermal engineering. This multidisciplinary team ensures that each motherboard is optimized for stability, compatibility, and thermal efficiency.


The R&D process begins with detailed customer requirement analysis. For OEM and ODM projects, Angthumb provides schematic design, PCB layout, chipset tuning, power architecture optimization, and BIOS customization. Engineers use industry-standard simulation tools to analyze impedance, EMI, and power integrity before physical prototyping.


Each new design undergoes iterative validation, including thermal chamber testing, full-load operation, compatibility checks with memory, storage, and expansion cards, and long-term reliability assessment. This structured development cycle shortens time-to-market while ensuring that each motherboard meets its performance targets.

Angthumb’s R&D team also explores advanced platforms such as Intel 12th/13th Gen, AMD Zen architectures, and high-density industrial form factors like Mini-ITX and Thin-ITX.

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Contact: Tom

Phone: +86 18933248858

E-mail: tom@angxunmb.com

Whatsapp:+86 18933248858

Add: Floor 301 401 501, Building 3, Huaguan Industrial Park,No. 63, Zhangqi Road, Guixiang Community, Guanlan Street,Shenzhen,Guangdong,China