From IQC to Final Testing: Angthumb’s Full-Cycle Quality Assurance System

Angxun Technology maintains a strict quality management system designed to ensure reliability, durability, and consistency in every motherboard shipped. The process begins with IQC (Incoming Quality Control), where all components—ICs, capacitors, connectors, MOSFETs—undergo sampling and verification before entering production. Only components that pass AQL standards move to the SMT lines.

During production, IPQC (In-Process Quality Control) engineers oversee critical steps such as solder paste printing, reflow temperature, and visual inspection. AOI machines scan each board after placement and soldering to maintain zero-defect standards. Any abnormalities trigger immediate corrective action.

After assembly, QC teams conduct functional tests, signal stability tests, BIOS verification, boot testing, memory compatibility tests, and power integrity checks. Industrial motherboards also undergo extended burn-in cycles, thermal aging, and full-load stress testing to ensure long-term reliability.

Before packaging, QA (Quality Assurance) performs final sampling and verifies labeling, serial tracking, and overall appearance. Angthumb’s entire workflow aligns with ISO9001 standards, ensuring that every motherboard meets international customer expectations.