Motherboard material

Motherboard material

Printed circuit board (PCB) material

Fiberglass (FR-4)

Basic introduction: This is the most commonly used PCB material for motherboards. FR-4 is an epoxy fiberglass cloth-based copper-clad laminate with good electrical properties, mechanical properties and chemical stability. It can provide stable support for electronic components on the motherboard and maintain good performance under different environmental conditions (such as temperature and humidity changes).

Electrical performance: Its dielectric constant (Dk) and dielectric loss factor (Df) are relatively low, which means that when high-frequency signals are transmitted, the signal loss is small and the integrity of the signal can be guaranteed. For example, in high-speed data transmission scenarios, such as motherboards that support PCI-e 4.0 or higher standards, FR-4 materials help reduce signal reflection and attenuation and ensure accurate data transmission.

Mechanical performance: FR-4 has high strength and hardness, can withstand the weight of various electronic components, and will not easily deform during installation (such as inserting memory sticks, graphics cards, etc.). For example, when a user inserts a large high-end graphics card into the PCI-e slot of the motherboard, the motherboard can rely on the strength of the FR-4 material to remain stable, avoiding poor contact or component damage due to physical deformation.

Chemical stability: It has good tolerance to most chemicals and can prevent corrosion during daily use (such as contact with chemical impurities in dust, slight liquid splashes, etc.). This helps to extend the service life of the motherboard.

Other special PCB materials

High-frequency materials (such as Rogers materials): mainly used for some special motherboards with extremely high requirements for high-frequency signal transmission, such as high-end server motherboards or professional radio communication equipment motherboards. These materials have lower dielectric constants and dielectric loss factors than FR-4, and can achieve more accurate signal transmission at extremely high frequencies (such as GHz level). For example, in the signal processing motherboard of a 5G base station, the use of Rogers materials can better handle high-frequency 5G signals and reduce signal distortion.

Ceramic-based materials: have excellent heat dissipation performance and high-frequency characteristics. Ceramic materials have high thermal conductivity and can quickly conduct heat away from heating elements, which is very important for some high-power electronic equipment motherboards. At the same time, ceramic-based materials can also maintain good signal transmission performance in high-frequency environments, but their cost is relatively high, and they are generally used for electronic product motherboards in the military, aerospace and other fields that have extremely high requirements for performance and reliability.

Intel Tiger Lake-U Thin Mini-ITX with VGA/HDMI/LVDS，SATA，1*COM，Dual M.2，M.2 WIFI，Dual DDR4，DC 12V~19V Input，which is Angthumb AIO-T11GD ,the following parameters are supported：

▲Support for Intel Tiger Lake-U series processors

▲Support DDR4 memory, maximum support 32GB 3200MHz SDRAM

▲Support 5.1-channel ALC897 chip with on-board power amplifier

▲Support 1 serial port, only support RS232 mode

▲Support 4 USB3.0, 4 USB2.0

▲Support 2 NVME M.2

▲Support 1 x 7Pin SATA interface

▲Support 1 RJ45 Gigabit network card interface

▲Support VGA/HDMI/LVDS (EDP) display interface, and support

synchronous three displays

▲Support DC power supply 12V~19V input

▲Support Windows 10 32/64-bit operating system, Linux system

Angxun has been in the motherboard industry for more than 20 years. Registered the brand Angthumb in many countries,we have focused on the production and research and development of intel motherboard,all in one motherboard,and Industrial motherboard,server motherboard ，RAM,SSD,CPU,GPU etc.The website is : www.angthumb.com to know more!