The development history of computer motherboard materials
1. Early stage
Phenolic paper substrate era: From the 1940s to the 1960s, computer motherboards initially used phenolic paper substrates. This substrate is made of pulp and phenolic resin, has certain mechanical strength and insulation properties, and can meet the needs of simple electronic circuits at the time. For example, the internal connection lines of early electronic tube computer motherboards, such as ENIAC in 1946, were built on materials such as phenolic paper substrates. However, phenolic paper substrates have obvious disadvantages. They have poor heat resistance and are easily deformed and damaged in high temperature environments. In addition, their electrical properties are relatively low and cannot meet the requirements of high-speed signal transmission.
Initial application of fiberglass board: From the 1960s to the 1970s, with the development of electronic technology, fiberglass board began to be used in motherboard manufacturing. Fiberglass board uses glass fiber cloth as a reinforcing material, is impregnated with epoxy resin and then hot-pressed, and is usually called FR4 substrate. Compared with phenolic paper substrate, FR4 substrate has better mechanical strength, heat resistance and electrical insulation properties, and can adapt to more complex electronic component installation and wiring requirements. This allows the motherboard to carry more electronic components and work stably under harsher environmental conditions. For example, the Atar 8800 computer motherboard launched in 1975 began to use fiberglass boards.
2. Development stage
The rise of multilayer boards: From the late 1970s to the 1980s, multilayer printed circuit board technology gradually matured and was applied to motherboard manufacturing. Multilayer boards are multiple double-sided boards or multilayer boards pressed together through a special process, with multiple signal layers, power layers and ground layers inside. This structure greatly improves the wiring density and electrical performance of the motherboard, allowing the computer to achieve more complex functions. For example, the motherboards of IBM PC and its compatible machines began to adopt multilayer board design, which provided a basis for the improvement of computer performance and the expansion of functions. At the same time, the application of multilayer boards also allows the size of the motherboard to be further reduced, which helps the computer to develop towards miniaturization.
The cooperation of surface mount technology: From the 1980s to the 1990s, the emergence and development of surface mount technology (SMT) complemented the multilayer board technology. SMT technology allows electronic components to be mounted directly on the surface of a printed circuit board, without the need to drill holes in the circuit board to insert components as with traditional through-hole mounting technology. This not only improves production efficiency and reduces production costs, but also further reduces the size and spacing of components, improving the integration and performance of the motherboard. At this stage, various chips, resistors, capacitors and other components on the motherboard are gradually installed using surface mounting technology, making the motherboard more compact and efficient.
Today, We also have cost-effective motherboards,Angxun Intel® Core™ i7/i5/i3 LGA1151 ATX with VGA,HDMI,Single LAN,M.2, Dual DDR4,which is Angthumb B365M-S2-V1.0 ,the following parameters are supported:
▲ Support I7 / I5 / I3 and Ccy Young LGA1151 pin series processor
▲ Support 4 SATA interface, 4 USB3.0, 6 USB2.0
▲ Supported DDR4 dual channel memory slot: support 2133 MHZ / 2400
MHZ, 2666 MHZ / 3000 MHZ,3200 MHZ, the maximum capacity of 32 GB
▲ High speed USB3.0 interface transmission speed to improve
▲ Support M.2 *1
▲ Supports PCIE expansion slot *2
▲ RJ45 Gigabit NIC interface
▲ Support 5.1 audio channel, ALC662 chip
▲ 4 layer PCB baseboard,3+1 phase power supply
▲ Support Win10 32/64 bit operating system
Angxun has been in the motherboard industry for more than 20 years. Registered the brand Angthumb in many countries,we have focused on the production and research and development of intel motherboard,all in one motherboard,and Industrial motherboard,server motherboard,RAM,SSD,CPU,GPU etc.The website is : www.angthumb.com to know more!
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Phone: +86 18933248858
E-mail: tom@angxunmb.com
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