High-Precision SMT & DIP: The Core of Angthumb’s Manufacturing Excellence

Surface-mount technology (SMT) is the foundation of reliable motherboard production, and Angthumb has invested heavily in world-class SMT infrastructure. Its five SMT lines utilize high-speed chip shooters, automatic solder paste printers, and SPI inspection machines. By enforcing precise control over solder volume, component alignment, and reflow temperature, Angthumb significantly reduces defect rates and improves electrical performance.

AOI (Automated Optical Inspection) systems serve as the second safeguard. These machines scan every motherboard to detect misalignment, insufficient solder, bridging, or potential defects invisible to the human eye. This ensures early error detection before boards proceed to later stages.

Angthumb’s DIP (Dual In-line Packaging) assembly is equally rigorous. Components requiring through-hole mounting undergo wave soldering with strict thermal profiling. Manual insertion teams receive continuous training to ensure stable workmanship. Combined with post-solder AOI and functional testing, Angthumb maintains exceptional consistency in mixed-technology assemblies.

These capabilities allow Angthumb to support Intel, AMD, industrial, and AIO motherboards with varied layouts and densities. Whether producing high-volume consumer boards or specialized industrial designs, Angthumb ensures precision, reliability, and efficiency.